Co-Packaged Optical Modules for HPC, Data Center and AI Applications
August 14 @ 10:30 am - 12:00 pm
Abstract :
This talk will cover the current status of co-packaging efforts, both VCSEL- and SiPh-based, where they fit into the Ethernet switch market and the evolving Computer IO market, and how these technologies are advancing HPC, Data Center, and AI applications. The emphasis will be on new requirements and challenges driven by AI <a href="http://systems.
Co-sponsored” target=”_blank” title=”systems.
Co-sponsored”>systems.
Co-sponsored by: <a href="http://C2MI.
Speaker(s):” target=”_blank” title=”C2MI.
Speaker(s):”>C2MI.
Speaker(s): Daniel M. Kuchta
Agenda:
9h45-10h30: arrival of participants on-site, coffee and networking
10:30am-11:30am: Tech Talk (hybrid)
11:30am-12pm: C2MI lab tour on-site for IEEE Photonics Montreal members
12pm: departure and end of event
Bldg: C2MI, C2MI, 45 Blvd de l’Aeroport, Bromont, Quebec, Canada, J2L 1S8, Virtual: https://events.vtools.ieee.org/m/491772