Scaling AI with Chiplet-Based Systems
November 26 @ 10:00 am - 11:00 am
Technical Seminar by IEEE Solid-State Circuits Society Distinguished Lecturer, Dr. Tony Chan Carusone, with the following abstract:
In the rapidly evolving landscape of artificial intelligence, chiplets are emerging as a transformative technology, paving the way for the next generation of AI systems. Chiplets permit the integration of more processing power within a single package, and allow for new connectivity solutions so that thousands of AI accelerators can work as a cohesive unit. Optical connectivity, facilitated by chiplets, offers high-speed data transmission with lower power consumption, crucial for handling the massive data loads in AI applications. The emerging chiplet ecosystem, underwritten by high-performance die-to-die interfaces, is throwing open the doors of innovation and facilitating the next wave of AI <a href="http://scaling.
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Speaker(s): Tony Chan Carusone,
Room: 3038, Bldg: Macleod Building, 2356 Main Mall, Vancouver, British Columbia, Canada, V6T 1Z4