Fundamentals of Signal Integrity for High-Speed Applications and Advances in Packaging Technology

This talk will explore the fundamentals of signal integrity (SI) in high-speed applications, with a focus on both frequency- and time-domain analysis. Attendees will gain a foundational understanding of how signal loss, crosstalk, and reflections affect system performance at high data rates. The presentation will also highlight recent advances in packaging techniques for broadband applications, including chiplets and advanced interconnects, and how these innovations help address challenges in high-frequency design. This session aims to bridge the gap between SI fundamentals and modern packaging technologies, offering a comprehensive overview for engineers and students working on broadband <a href="http://systems.

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At the end of the talk, the speaker will provide a summary of IEEE resources available to students and young professionals in the RF <a href="http://field.

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Speaker(s): Dr. Ahmed Abdelltif,

200 University Ave W, Waterloo, Ontario, Canada, N2L 3G1