The AFSIW Technological Platform : The High Performance Millimeter-Wave PCB Alternative

Introduced in the early 2000s, the substrate integrated waveguide (SIW) technology, has trigged a huge interest from academia to industry with the focus on the design and development of low-loss, compact, integrated, self-packaged and low-cost microwave and millimeter-wave circuits, antennas and systems. However, the classical metallic waveguide technology, which offers better performances such as lower insertion loss and higher power handling, has still been used in the design of microwave and millimeter-wave systems, despite its higher cost and bulky structure. To offer a highly integrated, further loss-reduced, low-cost alternative to the conventional waveguide and also to allow a wide-spread use of the millimeter-wave spectrum, a new SIW structure called Air-Filled SIW (AFSIW) has been introduced. This new structure has been theoretically and experimentally studied in details with a substantial amount of results. At millimeter wave frequencies, compared to the SIW topologies, the proposed AFSIW scheme exhibits a substantially lower insertion loss (three times at Ka-band, for example) and a much higher average power handling capability (four times, at Ka-band for example). Numerous AFSIW passive components have been investigated designed and demonstrated, which take advantages of the well-established multilayer printed circuit board (PCB) fabrication process. Couplers, phase shifters, power dividers, antennas and filters have been modeled, designed, prototyped and measured based on the introduced technology. Their performances have theoretically and experimentally been compared with their SIW counterparts to demonstrate and validate the benefits of the proposed <a href="http://technology.

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Co-sponsored”>technology.

Co-sponsored by:
STARaCom,
INRS

Speaker(s): Anthony Ghiotto , Professor Daniel Mittleman

Room: 6th floor, 800 Rue De la Gauchetière Ouest, 1501, Montréal, Quebec, Canada, H5A 1K8