Abstract :AIM Photonics, a Department of Defense (DoD) Manufacturing Innovation Institute (MII), offers end-to-end services in photonic integrated circuits (PICs), interposers, heterogeneous integration (HI), electronic photonic design automation (EPDA), and packaging. AIM Photonics leverages the 300 mm Albany NanoTech Complex and the Test Assembly and Packaging (TAP) facility in Rochester, NY, to provide these state-of-the-art capabilities. As a DoD MII, AIM Photonics’ mission is to advance the photonics and packaging industries to help improve the U.S. ecosystem and build a skilled <a href="http://workforce.This" target="_blank" title="workforce.This">workforce.This talk will focus on how AIM Photonics is accomplishing its mission. To help advance the ecosystem, AIM Photonics offers interposer technologies and the two fundamental PIC technologies: Base Multi-Project Wafer (MPW) and SiN MPW, which are optimized for sensors. In addition to the current offerings, AIM Photonics will soon offer a Quantum Flex (QFlex) MPW optimized for quantum <a href="http://applications.Because" target="_blank" title="applications.Because">applications.Because of the challenges in photonic packaging, packaging PIC chips into functional optoelectronic systems has not fully incorporated the advances made in electronic packaging. Addressing these challenges will require a coordinated development of PIC fabrication processes and packaging technologies. An end-to-end development cycle that includes the PIC and packaging is critical. This talk will discuss the AIM Photonics ecosystem and provide specific examples to illustrate co-processing and <a href="http://co-design.Another" target="_blank" title="co-design.Another">co-design.Another challenge that AIM Photonics is addressing is the development of a skilled workforce. This talk will share an overview of our education and workforce development programs, which aim to build a qualified workforce to support the U.S. <a href="http://ecosystem.Co-sponsored" target="_blank" title="ecosystem.Co-sponsored">ecosystem.Co-sponsored by: McGill Optica Student ChapterSpeaker(s): David HarameAgenda: 12 - 1:30 pm: networking lunch, with students (on-site only)1:30 – 3 pm: technical seminar presentation (hybrid)Room: MC603, 6th floor, Bldg: McConnell Engineering building, 3480 rue University, Montreal, Quebec, Canada, H3A 0C3, Virtual: https://events.vtools.ieee.org/m/472834

In an age when 5G is already reshaping industries and everyday life, continuous innovation is essential to unlock its full potential. The IEEE testbed provides a dynamic environment where academia, industry, and government collaborate to experiment with emerging technologies, validate pioneering ideas, and set the stage for future 6G standards. By bridging the gap between theoretical research and practical application, this platform is critical for developing innovative solutions to real-world challenges. The testbed is equipped with a comprehensive suite of tools and resources, and cutting-edge edge computing capabilities. These components enable rigorous testing of new architectures and protocols, ensuring that breakthroughs in technology can be swiftly translated into viable applications and use cases. By fostering strong partnerships across diverse sectors, the testbed promotes the exchange of ideas and joint research efforts. This synergy not only accelerates technological progress but also opens doors to collaborative projects and shared funding opportunities. Researchers and industry professionals alike are empowered to work together towards common goals—developing robust 5G solutions while laying the groundwork for the innovations of 6G. Moreover, the testbed supports a range of courses and training programs that equip the next generation of engineers and researchers with up-to-date, practical skills. This lecture will delve into the testbed’s core components, discuss its role in driving technological innovation, and outline ways for new participants to become an integral part of this evolving ecosystem. Audience will be able to explore how the IEEE 5G/6G Innovation Testbed is shaping the future of wireless connectivity, establishing new industry standards, and fueling collaborative progress across academia and <a href="http://industry.Speaker(s):" target="_blank" title="industry.Speaker(s):">industry.Speaker(s): Anwer Al-Dulaimi, Room: 146, 12280 NE District Wy, Bellevue, Washington, United States, 98005