Ongoing

IEEE Vancouver @ Worldcon 2025 in Seattle

Bldg: Summit Expansion, Seattle Convention Center, 900 Pine Street, Seattle, Washington, United States, 98101

(https://seattlein2025.org/)IEEE" target="_blank" title="https://seattlein2025.org](https://seattlein2025.org/)IEEE">https://seattlein2025.org](https://seattlein2025.org/)IEEE will be there, and you have an opportunity to attend and contribute as an IEEE member or student member alongside your peers from Seattle Section for a day, for a few days, or for the entire event. We’re hoping for a good turnout from Vancouver on the weekend: Fri, 15 August, Sat, 16 August and Sun, 17 <a href="http://August.Instructions" target="_blank" title="August.Instructions">August.Instructions for registering for the conference can be found athttps://seattlein2025.org/memberships/memberships/ .You have multiple options including day passes, full conference registration, <a href="http://etc.IEEE" target="_blank" title="etc.IEEE">etc.IEEE will have a booth at Worldcon. If you would like to volunteer to join a shift or two, please let us know!IEEE members like myself, Alon Newton, John Vertner, and Tom Coughlin (2024 President) will be at Worldcon. We hope that you can join us!In the meantime, please help us plan ahead by registering through this vTools page so that we can gauge interest and keep you informed. At this point, you’re simply expressing interest. Final confirmation won’t be required for a week or <a href="http://two.David" target="_blank" title="two.David">two.David MichelsonCounsellor, IEEE Student Branch @ UBCBldg: Summit Expansion, Seattle Convention Center, 900 Pine Street, Seattle, Washington, United States, 98101

Co-Packaged Optical Modules for HPC, Data Center and AI Applications

Bldg: C2MI, C2MI, 45 Blvd de l'Aeroport, Bromont, Quebec, Canada, J2L 1S8, Virtual: https://events.vtools.ieee.org/m/491772

Abstract :This talk will cover the current status of co-packaging efforts, both VCSEL- and SiPh-based, where they fit into the Ethernet switch market and the evolving Computer IO market, and how these technologies are advancing HPC, Data Center, and AI applications. The emphasis will be on new requirements and challenges driven by AI <a href="http://systems.Co-sponsored" target="_blank" title="systems.Co-sponsored">systems.Co-sponsored by: <a href="http://C2MI.Speaker(s):" target="_blank" title="C2MI.Speaker(s):">C2MI.Speaker(s): Daniel M. KuchtaAgenda: 9h45-10h30: arrival of participants on-site, coffee and networking10:30am-11:30am: Tech Talk (hybrid)11:30am-12pm: C2MI lab tour on-site for IEEE Photonics Montreal members12pm: departure and end of eventBldg: C2MI, C2MI, 45 Blvd de l'Aeroport, Bromont, Quebec, Canada, J2L 1S8, Virtual: https://events.vtools.ieee.org/m/491772