Events for February 17, 2026

This interactive LinkedIn Profile Optimisation Workshop is designed to help STEM students build a strong and professional LinkedIn presence aligned with current Canadian job market expectations. Participants will learn how to effectively showcase their skills, projects, research, and experiences while improving profile visibility and recruiter engagement. The session will include practical guidance, best practices, and actionable tips to help students optimise their LinkedIn profiles for industry, research, and graduate opportunities, and will be conducted by experts from UNB Career Development & Employment <a href="http://Services.Speaker(s):" target="_blank" title="Services.Speaker(s):">Services.Speaker(s): Sarah, Agenda: ✔️ Understanding the role of LinkedIn in today’s job market✔️ Optimising key profile sections (headline, summary, experience, skills)✔️ Showcasing projects, research, and technical skills effectively✔️ Common LinkedIn mistakes & best practices✔️ Networking strategies and recruiter visibility tips✔️ Live Q&A and profile improvement guidanceRoom:H114 , Bldg: Head Hall ,15 Dineen Dr, University of New Brunswick (UNB), Fredericton, New Brunswick, Canada, E3B 5A3

This hands-on PCB design workshop introduces students to the complete printed circuit board (PCB) design process by guiding them to create a personalized LED name board. Participants will learn how to design a simple LED and resistor circuit, lay out components, route traces, and add custom text or graphics using KiCad, a free and open-source PCB design <a href="http://tool.By" target="_blank" title="tool.By">tool.By the end of the session, students will export fabrication-ready Gerber files and gain practical insight into how real PCBs are designed and manufactured. No prior PCB experience is required; this workshop is beginner-friendly and focused on learning by <a href="http://doing.Agenda:" target="_blank" title="doing.Agenda:">doing.Agenda: Workshop Agenda-Introduction to Printed Circuit Boards (PCBs)-LED Circuit Design Using KiCad-PCB Layout and Trace Routing-Personalizing the Board (Name & Silkscreen Design)-Exporting Gerber Files for Fabrication-Q&A and Next StepsRoom:H114 , Bldg: UNB Head Hall , 15 Dineen Drive, , Fredericton, New Brunswick, Canada,E3B 5A3

Abstract:The IEEE 802 LAN/MAN Standards Committee develops and maintains networking standards and recommended practices from body area to metropolitan area networks, using an open and accredited process, and advocates them on a global basis. Among its working groups 802.11, 802.15, 802.18 and 802.19 focus on wireless communication. In this talk, we review those task groups' current projects and activities, focusing on latest projects. We will provide suggestions on how researchers from academia can contribute and benefit from the 802 standardization <a href="http://process.Bio:Tunçer">process.[]Bio:Tunçer Baykas (SM) is currently associate professor at Kadir Has University. After receiving his Ph.D. degree from the University of Ottawa, he joined the National Institute of Information and Communications Technology, Japan, in 2007. During his tenure, he contributed to multiple standardization projects, including IEEE 802.15.3c, IEEE 802.11ad, and IEEE 1900.7. He served as the Chair for IEEE 802.19.1 Task Group. Between 2012 and 2014, he worked as a postdoctoral researcher at Tohoku University, where he contributed to the development of the IEEE 802.15.4k Low Energy Critical Infrastructure Management Standard. Between 2016 and 2019 he represented NICT in the International Telecommunication Union Radiocommunication Sector, and he was the drafting group Chair of the 1A-3 and 5C-3 groups on WRC-19 agenda item 1.15.He has served as a Guest Editor for IEEE Communications Magazine and a Board Member for IEEE Comsoc MMTC E-Letters. He is currently serving as the Chair of the 802.19 Working Group, the IEEE Türkiye Comsoc Chapter, and corresponding member of the IEEE TAB <a href="http://COS.Virtual:" target="_blank" title="COS.Virtual:">COS.Virtual: https://events.vtools.ieee.org/m/538025