Virtual: https://events.vtools.ieee.org/m/554357

[]In the rapidly evolving landscape of artificial intelligence, chiplets are emerging as a transformative technology, paving the way for the next generation of AI systems. Chiplets permit the integration of more processing power within a single package and allow for new connectivity solutions so that thousands of AI accelerators can work as a cohesive unit. Optical connectivity, facilitated by chiplets, offers high-speed data transmission with lower power consumption, crucial for handling the massive data loads in AI applications. The emerging chiplet ecosystem, underwritten by high-performance die-to-die interfaces, is throwing open the doors of innovation and facilitating the next wave of AI <a href="http://scaling.Speaker(s):" target="_blank" title="scaling.Speaker(s):">scaling.Speaker(s): Tony Chan Carusone, Virtual: https://events.vtools.ieee.org/m/554357