Radiative communication using electromagnetic (EM) fields is the state-of-the-art for connecting wearable and implantable devices enabling prime applications in the fields of connected healthcare, electroceuticals, neuroscience, augmented and virtual reality (AR/VR) and human-computer interaction (HCI), forming a subset of the Internet of Things called the Internet of body (IoB). However, owing to such radiative nature of the traditional wireless communication, EM signals propagate in all directions, inadvertently allowing an eavesdropper to intercept the information. Moreover, since only a fraction of the energy is picked up by the intended device, and the need for high carrier frequency compared to information content, wireless communication tends to suffer from poor energy-efficiency (>nJ/bit). Noting that all IoB devices share a common medium, i.e. the human body, utilizing the conductivity of the human the body allows low-loss transmission, termed as human body communication (HBC) and improves energy-efficiency. Conventional HBC implementations still suffer from significant radiation compromising physical security and efficiency. Our recent work has developed Electro-Quasistatic Human Body Communication (EQS-HBC), a method for localizing signals within the body using low-frequency transmission, thereby making it extremely difficult for a nearby eavesdropper to intercept critical private data, thus producing a covert communication channel, i.e., the human body as a ‘wire’ along with reducing <a href="http://interference.In" target="_blank" title="interference.In">interference.In this talk, I will explore the fundamentals of radio communication around the human body to lead to the evolution of EQS-HBC and show recent advancements in the field which has a strong promise to become the future of Body Area Network (BAN). I will show the theoretical development of the first Bio-Physical Model of EQS-HBC and how it was leveraged to develop the world’s lowest-energy (100x improvement in energy-efficiency over Bluetooth. Finally, I will highlight the possibilities and applications in the fields of HCI, Medical Device Communication, and Neuroscience including a few videos demonstrations. We will also highlight how such low-power communication in combination with in-sensor intelligence is paving the way forward for Secure and Efficient IoB Sensor <a href="http://Nodes.Speaker(s):" target="_blank" title="Nodes.Speaker(s):">Nodes.Speaker(s): Prof. Shreyas Sen, Room: BA 1240, Bldg: Bahen Centre for Information Technology, University of Toronto, Toronto, Ontario, Canada, M5S 2E4

We’re pleased to invite you to a seminar by Dr. Ahmed Abdellatif from Microchip Technology:This talk will explore the fundamentals of signal integrity (SI) in high-speed applications, with a focus on both frequency- and time-domain analysis. Attendees will gain a foundational understanding of how signal loss, crosstalk, and reflections affect system performance at high data rates. The presentation will also highlight recent advances in packaging techniques for broadband applications, including chiplets and advanced interconnects, and how these innovations help address challenges in high-frequency design. This session aims to bridge the gap between SI fundamentals and modern packaging technologies, offering a comprehensive overview for engineers and students working on broadband <a href="http://systems.At" target="_blank" title="systems.At">systems.At the end of the talk, the speaker will provide a summary of IEEE resources available to students and young professionals in the RF <a href="http://field.Speaker(s):" target="_blank" title="field.Speaker(s):">field.Speaker(s): Dr. Ahmed Abdelltif, Room: BA4287, Bldg:Bahen Centre for Information Technology, 40 St. George Street Toronto, ON, M5S 2E4, Toronto, Ontario, Canada, M5S 2E4

This talk will explore the fundamentals of signal integrity (SI) in high-speed applications, with a focus on both frequency- and time-domain analysis. Attendees will gain a foundational understanding of how signal loss, crosstalk, and reflections affect system performance at high data rates. The presentation will also highlight recent advances in packaging techniques for broadband applications, including chiplets and advanced interconnects, and how these innovations help address challenges in high-frequency design. This session aims to bridge the gap between SI fundamentals and modern packaging technologies, offering a comprehensive overview for engineers and students working on broadband <a href="http://systems.At" target="_blank" title="systems.At">systems.At the end of the talk, the speaker will provide a summary of IEEE resources available to students and young professionals in the RF <a href="http://field.Speaker(s):" target="_blank" title="field.Speaker(s):">field.Speaker(s): Dr. Ahmed Abdelltif, Bldg: EIT 3142, 200 University Ave W, Waterloo, Ontario, Canada, N2L 3G1

Abstract: Channel estimation plays a pivotal role in the performance and reliability of 5G Radio Access Network (RAN) systems, particularly under the demanding requirements of enhanced mobile broadband (eMBB), ultra-reliable low-latency communications (URLLC), and massive machine-type communications (mMTC). In 5G, the use of massive MIMO, millimeter-wave (mmWave) frequencies, and flexible numerologies introduces new challenges and opportunities for accurate and efficient channel estimation. This presentation explores advanced channel estimation techniques tailored for 5G <a href="http://NR.Bio:" target="_blank" title="NR.Bio:">NR.Bio: Dr. Salari earned his Ph.D. in electrical engineering from K.N. Toosi University of Technology in 2007. His research journey has taken him through esteemed institutions such as Ontario Tech University, the University of Toronto, Queens’ University, and the Royal Military College of Canada. Transitioning to industry, he joined Ericsson Canada Inc. in 2020 as a system developer. His scholarly pursuits encompass wireless communications, digital signal processing, next generation 5G/6G networks, and optimization <a href="http://theory.---------------------------------------------------------------Speaker(s):" target="_blank" title="theory.---------------------------------------------------------------Speaker(s):">theory.---------------------------------------------------------------Speaker(s): Soheil, Agenda: 12:30 Pizza lunch1:00 IEEE TalkRoom: S4214, Bldg: Sawyer, Royal Military College, 17 General Crerar Crescent, Kingston, Ontario, Canada

[]Join the IEEE Toronto Instrumentation & Measurement – Robotics & Automation Joint Chapter for a technical talk presented by Dr. Roya Fallah Firoozi from University of <a href="http://Waterloo.Monday" target="_blank" title="Waterloo.Monday">Waterloo.Monday, August 11, 2025 @ 1:00 – 2:00 PM (EST)Abstract: As a robot manipulates 3D objects and navigates within 3D scenes, it requires spatial reasoning to ensure safe planning. Recent advances in 3D scene representation, such as Neural Radiance Fields (NeRFs) and Gaussian Splatting, provide high-fidelity digital twins of arbitrary real-world environments from multi-view images. In the first part of the talk, Dr. Firoozi will discuss employing these 3D visual fields augmented to 3D vision-language fields using internet-scale semantic representations from Vision-Language Models (VLMs) for open-vocabulary robot <a href="http://planning.As" target="_blank" title="planning.As">planning.As the robot interacts with other dynamic agents in the scene (multi-agent settings), it also requires temporal reasoning to ensure safe interactive planning. In the second part of the talk, Dr. Firoozi will discuss safe and fault-resilient planning techniques across two categories of interactive planning: (i) Model Predictive Control (MPC), where the prediction and planning steps are decoupled, and (ii) more abstract approaches such as game-theoretic planning, where these steps are tightly coupled. While MPC offers computational efficiency, game-theoretic planning enables more complex modeling of agents' preferences and their mutual <a href="http://influences.Speaker(s):" target="_blank" title="influences.Speaker(s):">influences.Speaker(s): Roya Fallah Firoozi, Ph.D., Virtual: https://events.vtools.ieee.org/m/487494

Emerging Developments in GHz Engineering (EDGE) 2025Emerging Developments in GHz Engineering (EDGE) 2025 marks the official inauguration of the IEEE MTT-S Thompson Okanagan Chapter. This full-day event is dedicated to advancing knowledge and collaboration in microwave, RF, and GHz-frequency engineering. EDGE 2025 brings together academic leaders, industry experts, researchers, and students for an engaging program featuring keynote talks, panel discussions, technical sessions, lab tours, and project demonstrations. The summit aims to establish a strong regional hub for innovation and excellence in GHz technologies, providing valuable networking and learning <a href="http://opportunities.The" target="_blank" title="opportunities.The">opportunities.The day begins with remarks from the executive members of the IEEE Thompson Okanagan Section, and interim officers of the MTT-S chapter, followed by the formal inauguration ceremony. Attendees will enjoy a range of activities including an industry panel, a Distinguished Microwave Lecture, a Young Professionals talk, and a networking lunch. Lab visits, project demonstrations, and a poster session offer hands-on experiences, while invited talks and industry presentations explore advanced microwave topics. The event concludes with student and technical presentations showcasing innovative research by emerging engineers and <a href="http://scientists.Speaker(s):" target="_blank" title="scientists.Speaker(s):">scientists.Speaker(s): Prof. Zarifi, , Thomas, Prof. Moez, Prof. MirzavandAgenda: Morning SessionTime Activity08:00 – 09:00 Breakfast and Networking09:00 – 09:30 Welcome Note and Inaugration of IEEE MTT-S Chapter09:35 - 10.05 Invited Talk: Design of mm-Wave and Sub-THz Phased-Array Beamformers in CMOS Technology forNext Generation Wireless Communication SystemsDr. Kambiz Moez, Professor and Associate Dean (Undergraduate Students), University of Alberta10:05 – 10:15 Coffee Break10:15 – 10:45 Distinguished Microwave Lecture (DML) Talk - Dr. Mohammad Zarifi, Associate Professor, University of British Columbia, Okanagan10:50 - 11:25 Industry Panel Discussion11:30 – 12:00 Young Professionals (YP) Talk - Dr. Vishal Balasubramanian, Postdoctoral Researcher, University of British Columbia, Okanagan12:00 – 13:00 Lunch Break---------------------------------------------------------------Afternoon SessionTime Activity13:00 – 14:00 Lab Visits / Project Demonstrations - Prof. Mohammad Zarifi, Prof. Thomas Johnson, Prof. Anas Chaaban14:00 – 14:30 Invited Talk - Dr. Rashid Mirzavand, Assistant Professor, University of Alberta14:30 – 15:00 Industry Talk - Dr. Thomas Jones, CEO, Jones Microwave <a href="http://Inc.15:00" target="_blank" title="Inc.15:00">Inc.15:00 – 16:00 Student / Technical PresentationsRoom: EME 0050, Bldg: UBC Okanagan Engineering, Management and Education Building, 1137 Alumni Avenue, Kelowna, British Columbia, Canada

Event will be limited to 25 <a href="http://participants.Join" target="_blank" title="participants.Join">participants.Join the IEEE London Chapter for an exclusive behind-the-scenes tour of the Fraunhofer Innovation Platform for Composites Research at Western University (FIP-Composites@Western) in London, Ontario. This is a fantastic opportunity to explore the innovation behind composite materials formulation, process and product development at this industrial-scale applied research facility that is part of Western <a href="http://University.About" target="_blank" title="University.About">University.About the Facility:The Fraunhofer Innovation Platform for Composites Research is a joint venture between Western University and the Fraunhofer Institute of Chemical Technology (ICT) in Pfinztal, Germany. The FIP-Composites at Western develop, test, validate, and characterize new lightweight materials and advanced manufacturing processes on an industrial scale. By combining Fraunhofer’s latest global technologies with Western’s strengths in materials engineering, the FIP-Composites at Western proactively addresses the needs of its industry <a href="http://partners.https://www.eng.uwo.ca/fraunhofer/Agenda:" target="_blank" title="partners.https://www.eng.uwo.ca/fraunhofer/Agenda:">partners.https://www.eng.uwo.ca/fraunhofer/Agenda: What to Expect:- Experience a close-up view of the industrial-scale applied research centre, part of Western <a href="http://University.-" target="_blank" title="University.-">University.- Discover Western’s state-of-the-art composites processing <a href="http://equipment.-" target="_blank" title="equipment.-">equipment.- Capabilities:- 2500 Tonne Compression Molding Press- 1600 Tonne and 500 Tonne Injection Molding Presses- Sheet Molding Compound Line- Long Fiber Thermoplastic Directline- High-Pressure Resin Transfer Molding Line- Pultrusion Line2520 Advanced Avenue, London, Ontario, Canada, N6M 0E1

(https://seattlein2025.org/)IEEE" target="_blank" title="https://seattlein2025.org](https://seattlein2025.org/)IEEE">https://seattlein2025.org](https://seattlein2025.org/)IEEE will be there, and you have an opportunity to attend and contribute as an IEEE member or student member alongside your peers from Seattle Section for a day, for a few days, or for the entire event. We’re hoping for a good turnout from Vancouver on the weekend: Fri, 15 August, Sat, 16 August and Sun, 17 <a href="http://August.Instructions" target="_blank" title="August.Instructions">August.Instructions for registering for the conference can be found athttps://seattlein2025.org/memberships/memberships/ .You have multiple options including day passes, full conference registration, <a href="http://etc.IEEE" target="_blank" title="etc.IEEE">etc.IEEE will have a booth at Worldcon. If you would like to volunteer to join a shift or two, please let us know!IEEE members like myself, Alon Newton, John Vertner, and Tom Coughlin (2024 President) will be at Worldcon. We hope that you can join us!In the meantime, please help us plan ahead by registering through this vTools page so that we can gauge interest and keep you informed. At this point, you’re simply expressing interest. Final confirmation won’t be required for a week or <a href="http://two.David" target="_blank" title="two.David">two.David MichelsonCounsellor, IEEE Student Branch @ UBCBldg: Summit Expansion, Seattle Convention Center, 900 Pine Street, Seattle, Washington, United States, 98101

Welcome to WindEEE! Please meet us in the lobby at the WindEEE Research Institute, located at 2535 Advanced Avenue, London, Ontario. Parking is located to the right of the building, follow the sidewalk to the main entrance on the left. You will need to ring the doorbell to be let <a href="http://in.How" target="_blank" title="in.How">in.How to Prepare for your Tour:You will be sitting, standing, walking, and briefly experiencing simulated tornado winds. An optional climb up and down a stepped ladder may be included depending on time/accessibility. Tours typically last between 60-90 <a href="http://minutes.Please" target="_blank" title="minutes.Please">minutes.Please wear comfortable, closed-toed shoes and clothing that won't get blown around (pants and fitted shirts are best). Avoid loose accessories or anything lightweight that might take flight. That said, get ready to let your hair down for some great photo opportunities!We look forward to seeing you!Agenda: You will be sitting, standing, walking, and briefly experiencing simulated tornado winds. An optional climb up and down a stepped ladder may be included depending on time/accessibility. Tours typically last between 60-90 <a href="http://minutes.2535" target="_blank" title="minutes.2535">minutes.2535 Advanced Avenue, London, Ontario, Canada, N6M 0E2

Abstract :This talk will cover the current status of co-packaging efforts, both VCSEL- and SiPh-based, where they fit into the Ethernet switch market and the evolving Computer IO market, and how these technologies are advancing HPC, Data Center, and AI applications. The emphasis will be on new requirements and challenges driven by AI <a href="http://systems.Co-sponsored" target="_blank" title="systems.Co-sponsored">systems.Co-sponsored by: <a href="http://C2MI.Speaker(s):" target="_blank" title="C2MI.Speaker(s):">C2MI.Speaker(s): Daniel M. KuchtaAgenda: 9h45-10h30: arrival of participants on-site, coffee and networking10:30am-11:30am: Tech Talk (hybrid)11:30am-12pm: C2MI lab tour on-site for IEEE Photonics Montreal members12pm: departure and end of eventBldg: C2MI, C2MI, 45 Blvd de l'Aeroport, Bromont, Quebec, Canada, J2L 1S8, Virtual: https://events.vtools.ieee.org/m/491772

Monthly Executive Team Meeting - IEEE Hamilton Section (Aug'2025)Agenda: 07:00PM - Meeting starts08:00PM - Meeting endsVirtual: https://events.vtools.ieee.org/m/494398

Join us for an exclusive IEEE Communications Society Distinguished Lecture featuring Prof. Houbing Herbert Song. Discover how neuro-symbolic AI merges neural networks with symbolic reasoning to unlock machines that move beyond data-driven learning to autonomously perceive, understand, reason, and learn directly from the world, ushering in the transformative Third Wave of Artificial <a href="http://Intelligence.Speaker(s):" target="_blank" title="Intelligence.Speaker(s):">Intelligence.Speaker(s): Dr. Houbing Herbert Song, Room: SB415, Bldg: Sobey Building, Saint Mary's University, 903 Robie St,Halifax, Nova Scotia, Canada, B3H 3C2, Virtual: https://events.vtools.ieee.org/m/494412