Events

Abstract:As industry is starting to deploy systems based on 224Gbps/lane and growing pains are becoming more apparent, AI companies are clamoring already for more bandwidth. A first look at 448Gbps is already highlighting the enormous challenges of running even very short links on copper. However, industry doesn’t seem yet ready to throw the towel on pluggable modules as gateways to optical interconnect given the risks and limitations of <a href="http://CPO.Some" target="_blank" title="CPO.Some">CPO.Some of the questions that will be covered:- Can we clearly articulate what are the priorities in developing the next generation of interconnect for AI?- What are the main obstacles to the adoption of short reach optics to replace the last inches of electrical connectivity?- What can we learn from advances in C2C and in particular by the success of UCIe?- Does it make sense to still have pluggable modules and what is the best way to do that?- Was LPO a success or a bust and can we move forward with it?- What are the promises and possible pitfalls of CPO?Topics touched upon:- System level (Computing, AI) requirements & considerations (architectural trends, efficiency, bw, latency, cost <a href="http://etc.)-" target="_blank" title="etc.)-">etc.)- Optical and electrical energy efficiency considerations- HW technology developments and limitations (interposer, packaging, connectors, cables)- System trade offs analysis (retiming vs. linear, vs. CPO)- Chiplets and co-packaging technology- Analysis of latest OIF development on next generation interconnectAgenda: Room: GB202, Bldg: Galbraith Building, University of Toronto, 35 St George Street, Toronto, Ontario, Canada

Join us for an evening of connection, insight, and interdisciplinary learning with leaders across the technology <a href="http://ecosystem.This" target="_blank" title="ecosystem.This">ecosystem.This flagship event brings together students, professionals, and members of the community to explore how interdisciplinary thinking drives innovation in today’s rapidly evolving technological landscape. From artificial intelligence and data to engineering, leadership, and entrepreneurship, our speakers will share how collaboration across fields is shaping the future of technology and creating new career <a href="http://pathways.Through" target="_blank" title="pathways.Through">pathways.Through a keynote, expert panel, and interactive networking experience, attendees will gain valuable perspectives, build meaningful connections, and learn how diverse skill sets and disciplines come together to solve complex real-world <a href="http://challenges.The" target="_blank" title="challenges.The">challenges.The evening will include:- Keynote Address- Industry Panel Discussion- Rotating Networking Session- Dinner & Community BuildingThis event is open to all community members at no cost. RSVP is <a href="http://mandatory.The" target="_blank" title="mandatory.The">mandatory.The event is co-sponsored by IEEE Southern Alberta and Faculty of Science and Technology at Mount Royal University, and is co-organized by the Department of Mathematics and Computing, Southern Alberta Computer Chapter and Women in Engineering, and CybHER <a href="http://club.Co-sponsored" target="_blank" title="club.Co-sponsored">club.Co-sponsored by: Faculty of Science and Technology of Mount Royal UniversityAgenda: Keynote Speaker- Maureen Higgins — Ernst & Young (EY)Panel Speakers- Colleen Pound — CEO, Proxure- Philippe Burns — CEO, Tech Thursday- Alex Tyrell & Dennis Pineda — Data & AI Team, Deloitte- Diwakar Krishnamurthy — Professor, University of Calgary- Fahad Zaidi — Director of Engineering, Neo FinancialBldg: Ross Glen Hall, 4825 Mount Royal Gate Southwest, Calgary, Alberta, Canada, T3E 6X4

UMake 2026 is a two-day hardware makeathon. Taking place on March 6–7, participants will form teams of four to design, build, and test a hands-on engineering solution to a themed robotics challenge. See UMake.umieee.ca for registrationTeams will have access to the new Engineering Makerspace, tools, components, and workspace throughout the event. Projects will be evaluated based on technical execution, creativity, functionality, and overall <a href="http://design.The" target="_blank" title="design.The">design.The event is open to students interested in hardware, robotics, and applied engineering design. No prior competition experience is <a href="http://required.•" target="_blank" title="required.•">required.• Free entry• Prizes awarded to top teams• One meal provided each daySpots are limited and advance registration is <a href="http://required.75" target="_blank" title="required.75">required.75 Chancellors Circle, Winnipeg, Manitoba, Canada, R2N 3W8

IEEE-Women in Engineering, Hamilton Sectioncordially invites you to join us forInternational Women's Day Social and NetworkingIEEE Women in Engineering – Hamilton Section invites you to celebrate International Women’s Day at a Social & Networking gathering with breakfast, meaningful conversations, and collaborative <a href="http://connections.Featured" target="_blank" title="connections.Featured">connections.Featured Speakers :Sneh Lata - Director of Products AI & Cloud Innovations <a href="http://www.rchilli.comLynn" target="_blank" title="www.rchilli.comLynn">www.rchilli.comLynn Page - Former Executive Director of Concession Street Business improvement area in HamiltonThis inspiring session will explore the evolving journey of women from overcoming barriers to leading innovation in the age of Responsible AI. Through shared experiences and forward-looking insights, we will reflect on resilience, leadership growth, and the meaningful impact women continue to make across industries. Together, we will celebrate progress, foster connection, and inspire continued advancement in leadership and <a href="http://technology.Fee" target="_blank" title="technology.Fee">technology.Fee Information:WIE member - Free , Guest : $20 + tax + gratuityRegister by : Friday, March 6th, 2026Agenda: 9:00 AM – 10:20 AM• Welcome & Opening Address• Breakfast• Networking10:20 AM – 10:45 AMLeadership & Innovation DialogueTopic: Women Rising – From Resilience to Responsible AIFeatured Speakers: Sneh Lata & Lynn Page10:45 AM – 10:55 AMQ&A Session11:00 AMClosing Reflections & NetworkingRoom: Main Floor - Lobby Level, Bldg: Holiday Inn Burlington & Conference Centre , Cycene Social Club , 3063 South Service Road, Burlington, Ontario, Canada, L7N 3E9

Fanshawe College students have the opportunity to attend a guided tour of one of London’s leading automation and robotics companies. BOS Innovations is recognized for its expertise in industrial automation, robotics integration, and advanced manufacturing solutions across multiple industries. Please note that students are responsible for arranging their own transportation to and from the BOS Innovations facility, located at 2335 Discovery Drive, London, ON N6M 0<a href="http://C6.IF" target="_blank" title="C6.IF">C6.IF YOU REGISTER FOR THIS EVENT AND CAN NO LONGER ATTEND, PLEASE UNREGISTER SO OTHER STUDENTS HAVE THE OPPORTUNITY TO <a href="http://PARTICIPATE.BOS" target="_blank" title="PARTICIPATE.BOS">PARTICIPATE.BOS HAS CONFIRMED THAT THIS TOUR IS EXCLUSIVELY FOR ELY AND EMN STUDENTS. ELIGIBLE STUDENTS WILL BE CONTACTED WITH REGISTRATION DETAILS AND INFORMATION ABOUT THE AVAILABLE JOB <a href="http://OPPORTUNITIES.Co-sponsored" target="_blank" title="OPPORTUNITIES.Co-sponsored">OPPORTUNITIES.Co-sponsored by: BOS Innovations <a href="http://Inc.2335" target="_blank" title="Inc.2335">Inc.2335 Discovery Drive, London, Ontario, Canada, N6M 0C6

Attending recording of an ISSCC 2026 paper on 175GS/s slope ADCsRoom: 415, Bldg: ICT, University of Calgary, Calgary, Alberta, Canada, T2N1N4

IEEE Mini-ConferenceAre you interested in IEEE technical societies? Don’t miss this opportunity to discover cutting-edge technologies through a mini conference featuring 2 professors and 4 graduate students on diverse subject like terahertz wave, machine learning, RF circuits and others electrical and software engineering <a href="http://topics.Free" target="_blank" title="topics.Free">topics.Free pizza provided for all participants!ETS - A-1300 – March 10 at 12:00 PM (Noon)Co-sponsored by: MTTS - ETSAgenda: 12:00 PM – 12:15 PM : Check-in & Pizza12:15 PM – 12:20 PM : Opening Remarks12:20 PM – 12:45 PM : Faculty "Keynote" Session (20 min + Q&A)-12:20 – 12:30: Richard Al Hadi– RF circuits-(10 min talk + 5 min Q&A)-12:35 – 12:45: Waël Jaafar - AI-(10 min talk + 5 min Q&A)12:45 PM – 1:10 PM : Graduate Student Lightning Talks (20 min + Q&A)-4 grad students will talk about their research focus in 5 mins format1:10 PM – 1:15 PM : Closing Words1:15 PM – 1:30 PM : Free timeRoom: A-1300, Bldg: A, 1100 R. Notre Dame O, Montréal, QC H3C 1K3, Montréal, Quebec, Canada, H3C 1K3

Every year, over one million people in the U.S. rush to the emergency room after experiencing their first seizure or seizure-like event. For many, the journey that follows is frustrating and uncertain. Epilepsy is notoriously difficult to diagnose - so much so that nearly 30% of patients receive the wrong diagnosis. The most common mistake? Being told they have epilepsy when they do not. These misdiagnosed patients spend months or even years trying ineffective medications, enduring unnecessary side effects, and living with the fear of seizures they don’t actually have only to later discover they have a completely different condition. Why is diagnosing epilepsy so difficult? Unlike other diseases, there has been no reliable biomarker. Our team has identified an EEG-based biomarker for epilepsy, a game-changing discovery that is currently being tested in three major epilepsy centers across the U.S. This new tool, EpiScalp, has the potential to revolutionize epilepsy diagnosis, ensuring patients receive the right answers and the right treatment from their very first visit to a <a href="http://neurologist.Speaker(s):" target="_blank" title="neurologist.Speaker(s):">neurologist.Speaker(s): Sridevi Sarma, PhD - EMBS Distinguished LecturerVirtual: https://events.vtools.ieee.org/m/537663

[]TECHNICAL PROGRAMThis program is dedicated to the memory of Omar Zubi, Boeing's longtime EMC Lab Manager, who passed away suddenly on January 31, 2026.EMC Challenges for ‘New Space’ Small Satellite DevelopmentBy Russell Carroll, EMI/EMC Consulting Engineer, EMI Sleuth, El Segundo, CA, USAAbstract: This presentation discusses EMC challenges seen by engineers in the ‘new space’ world of small satellite development. These challenges include non-standardized launch vehicle and host interface requirements, unspecified lightning protection requirements, and schedule constraints on EMC testing and development. Technical challenges include power and signal isolation, crosstalk from long pigtails in wire harnesses, limited physical space for filters and shielding, and large apertures in the vehicle faraday <a href="http://cage.Speaker" target="_blank" title="cage.Speaker">cage.Speaker Biography: Russell Carroll is a consulting engineer with extensive experience in the analysis, design, and testing of electromagnetic effects on units and systems including space satellites and industrial electronics. His research is focused on developing useful analysis tools and methods for unit and system level EMC analysis. Mr. Carroll is a registered Professional Engineer and an iNARTE certified EMC Engineer. He received the B.S. and M.S. degrees in electrical engineering from the University of Alaska Fairbanks in 2013 and 2014. He may be reached at russell@<a href="http://emisleuth.com.CISPR" target="_blank" title="emisleuth.com.CISPR">emisleuth.com.CISPR and ANSC C63® Overview on Site Validation Measurements from 18 GHz to 40 GHz - Latest Advances in EMC Test Site Evaluation Using Advanced Antenna Measurement TechniquesBy Zhong Chen, Chief Engineer, ETS-Lindgren, Cedar Park, Texas, USAAbstract: This presentation introduces a novel approach for EMC chamber validation beyond 18 GHz, currently under consideration in ANSI C63 and CISPR standards. By integrating Cylindrical Mode Filtered Site Voltage Standing Wave Ratio (CMF SVSWR) with Compressed Sensing (CS), we address inherent challenges in traditional SVSWR methods, such as inconsistency and slow data acquisition. CMF SVSWR utilizes circular path measurements and mode domain post-processing to discern antenna and chamber reflections, crucial for comprehensive VSWR analysis. Compressed Sensing, a data-driven machine learning technique, exploits signal sparsity to reconstruct data from fewer randomly sampled measurement points, thereby reducing test times and eliminating the need for precise turntable <a href="http://positioning.Speaker" target="_blank" title="positioning.Speaker">positioning.Speaker Biography: Zhong Chen is Chief Engineer at ETS-Lindgren, located in Cedar Park, Texas. He has more than 25 years of experience in RF testing, anechoic chamber design, as well as EMC antenna and field probe design and measurements. He is an active member of the ANSC C63® committee currently serving as Vice-Chair and is the immediate past Chair of Subcommittee 1 which is responsible for the antenna calibration (ANSI C63.5) and chamber/test site validation standards (ANSI C63.4 and the ANSI C63.25 series). Mr. Chen is chair of the IEEE Standard 1309 committee responsible for developing calibration standards for field probes, and IEEE Standard 1128 for absorber evaluation. He is a former member of the IEEE EMC Society Board of Governors and the Antenna Measurement Techniques Association (AMTA) Board of Directors. He is a past Distinguished Lecturer for the EMC Society and is recognized as an AMTA Fellow. His research interests include measurement uncertainty, time domain measurements for site validation and antenna calibration, and development of novel RF absorber materials. Several papers authored and co-authored by Mr. Chen have received best paper recognition at global conferences. Zhong Chen received his M.S.E.E. degree in Electromagnetics from the Ohio State University at Columbus. He may be reached at <a href="http://[email protected]" target="_blank" title="[email protected]">[email protected] Lab Tour and Demo Overview​By Dennis Lewis, Technical Fellow, The Boeing Company, and Zhong Chen, ETS-LindgrenAbstract:We will demonstrate how data post-processing can be used to extract antenna and chamber <a href="http://parameters.The" target="_blank" title="parameters.The">parameters.The first demo highlights time-domain techniques for evaluating absorber performance in anechoic chambers. In aerospace EMC testing, measurements are typically performed per MIL-STD 461, which requires only 10 dB attenuation above 250 MHz—allowing chambers to remain relatively reflective and without system-level validation. Using time-gated antenna reflection measurements, we show a practical method to verify and quantify actual chamber <a href="http://performance.If" target="_blank" title="performance.If">performance.If time permits, we will also demonstrate the Cylindrical Mode Filtered (CMF) technique. This method measures the antenna pattern with an intentional offset (e.g., placing the antenna at the edge of the turntable). The complex S21 versus angle at each frequency is transformed into the spectral domain, where filtering removes chamber contributions mathematically, producing a “clean” antenna pattern even in a nonideal environment. For site validation, standing-wave ripples are obtained by comparing the original chamber pattern to the filtered result. The demo will cover the full measurement workflow, including real-time post-processing. The CMF SVSWR technique is under consideration in the draft ANSI C63.25.3 by ANSC C63 and in CISPR 16 site validation standards for EMC test sites from 18 GHz to 40 <a href="http://GHz.MANY" target="_blank" title="GHz.MANY">GHz.MANY THANKS TO OUR LUNCH SPONSOR ROHDE & SCHWARZ!!Agenda: 1:00 pm - Registration Check-In and Complimentary Lunch Courtesy of Rohde & Schwarz1:40 pm - Welcome from Seattle EMC Chapter Chair, Janet O'Neil with ETS-Lindgren and Seattle AP/ED/MTT Chapter Chair, Dennis Lewis with Boeing1:45 pm - EMC Challenges for ‘New Space’ Small Satellite Development By Russell Carroll, EMI/EMC Consulting Engineer, EMI Sleuth, El Segundo, CA, USA2:30 pm - CISPR and ANSC C63® Overview on Site Validation Measurements from 18 GHz to 40 GHz - Latest Advances in EMC Test Site Evaluation Using Advanced Antenna Measurement Techniques By Zhong Chen, Chief Engineer, ETS-Lindgren, Cedar Park, Texas, USA3:30 pm - Refreshment Break3:50 pm - Overview of Boeing EMC Lab and Demo Set Up by Dennis Lewis, Technical Fellow with Boeing and Zhong Chen with ETS-Lindgren4:20 pm - Technical tour of the Boeing EMC Lab with LIVE demo5:00 pm - AdjournBldg: 2-122, Boeing, 7701 14th Ave Soutn, Seattle, Washington, United States, 98108

La Section IEEE de Québec invite tous les membres PES de la région à une rencontre visant à évaluer la création d’un Chapitre IEEE PES à Qué<a href="http://bec.Avec" target="_blank" title="bec.Avec">bec.Avec près de 50 membres PES dans la Section — la Société la plus représentée localement — nous souhaitons structurer cette communauté autour d’un Chapitre <a href="http://officiel.Objectifs" target="_blank" title="officiel.Objectifs">officiel.Objectifs de la rencontre :-Valider l’intérêt réel pour la création du Chapitre PES à Québec-Identifier au moins 12 membres prêts à appuyer formellement l’ouverture du Chapitre, afin d’enclencher le processus officiel IEEECette rencontre s’adresse à tous les membres IEEE PES de la région qui souhaitent contribuer au développement de la communauté énergie à Qué<a href="http://bec.Votre" target="_blank" title="bec.Votre">bec.Votre présence fera la diffé<a href="http://rence.Virtual:" target="_blank" title="rence.Virtual:">rence.Virtual: https://events.vtools.ieee.org/m/540109

Monthly Executive Team Meeting - IEEE Hamilton Section (Mar'2026)Agenda: 07:00PM - Meeting starts08:00PM - Meeting endsVirtual: https://events.vtools.ieee.org/m/539070

Quantum Dot Lasers Integrated via Optical Interconnects Using 3D-Printed Structured Microlenses and Photonic Wire BondingAbstract:Hybrid-integrated quantum dot (QD) coherent comb lasers provide broad bandwidth and high coherence, making them attractive for demanding applications such as precision metrology, high-capacity optical communications, and quantum information processing, especially when integrated with photonic integrated circuits (PICs). Various approaches have been explored to integrate III–V gain devices with silicon photonics, including monolithic, heterogeneous, and hybrid integration. However, each method faces challenges in reproducibility, scalability, and coupling efficiency. Recently, 3D-printed structures, including micro-lens and photonic wire bonding (PWB), have emerged as a promising solution. In this approach, a femtosecond pulsed laser is used to directly write low-loss polymer waveguides in three dimensions. These 3D-printed structures significantly reduce alignment sensitivity, offering two to three orders of magnitude higher tolerance compared to techniques such as flip-chip bonding, which requires sub-micron alignment accuracy in all three axes. This high tolerance enables efficient and low-loss coupling between different optical interfaces, including optical fibers, surface-emitting lasers, and edge-emitting lasers. Here, we demonstrate a co-packaging approach for hybrid-integrated QD multi-wavelength coherent comb lasers using PWB and 3D-printed micro-lens structures. Experimental results show stable comb mode locking, narrow optical linewidths, and low relative intensity noise, while maintaining a compact footprint. This work paves the way for robust hybrid photonic platforms for applications in quantum technologies, precision metrology, and advanced optical <a href="http://communications.------------------------------------------------------------------------Lasers" target="_blank" title="communications.------------------------------------------------------------------------Lasers">communications.------------------------------------------------------------------------Lasers à points quantiques intégrés via des interconnexions optiques utilisant des microlentilles structurées imprimées en 3D et la liaison par fil photoniqueRésumé:Les lasers à peigne de fréquences cohérents à points quantiques (PQ) hybrides offrent une large bande passante et une grande cohérence, ce qui les rend particulièrement intéressants pour des applications exigeantes telles que la métrologie de précision, les communications optiques à haut débit et le traitement de l’information quantique, notamment lorsqu’ils sont intégrés à des circuits photoniques intégrés (PIC). Différentes approches ont été explorées pour intégrer des dispositifs à gain III-V à la photonique sur silicium, notamment l’intégration monolithique, hétérogène et hybride. Cependant, chaque méthode présente des défis en termes de reproductibilité, d'évolutivité et d'efficacité de couplage. Récemment, les structures imprimées en 3D, notamment les microlentilles et le câblage photonique (PWB), sont apparues comme une solution prometteuse. Dans cette approche, un laser pulsé femtoseconde est utilisé pour écrire directement des guides d'ondes polymères à faibles pertes en trois dimensions. Ces structures imprimées en 3D réduisent considérablement la sensibilité à l’alignement, offrant une tolérance de deux à trois ordres de grandeur supérieure à celle de techniques telles que le flip-chip, qui exige une précision d’alignement submicronique sur les trois axes. Cette tolérance élevée permet un couplage efficace et à faibles pertes entre différentes interfaces optiques, notamment les fibres optiques, les lasers à émission de surface et les lasers à émission par tranche. Nous présentons ici une approche de co-encapsulation pour des lasers à peigne de fréquences cohérents multi-longueurs d'onde à points quantiques intégrés hybrides, utilisant des circuits imprimés et des structures de microlentilles imprimées en 3D. Les résultats expérimentaux démontrent un verrouillage de mode stable du peigne, des largeurs de raie optiques étroites et un faible bruit d'intensité relative, tout en conservant un encombrement réduit. Ces travaux ouvrent la voie à des plateformes photoniques hybrides robustes pour des applications dans les technologies quantiques, la métrologie de précision et les communications optiques avancé<a href="http://es.In" target="_blank" title="es.In">es.In order to promote more open discussions/interactions, at the end of the presentation and Q/A, we will allow other experts in this field (modeling of semiconductor laser) to present very briefly their work (1 slide, 2 min max) or their company. / Afin de favoriser des discussions/interactions plus ouvertes, à la fin de la présentation et des questions/réponses, nous permettrons aux experts de ce domaine (modélisation de lasers semi-conducteurs) de présenter très brièvement leurs travaux (1 diapositive, 2 min max) ou leur <a href="http://compagnie.About" target="_blank" title="compagnie.About">compagnie.About / A proposThe High Throughput and Secure Networks (HTSN) Challenge program is hosting regular virtual seminar series to promote scientific information sharing, discussions, and interactions between <a href="http://researchers.https://nrc.canada.ca/en/research-development/research-collaboration/programs/high-throughput-secure-networks-challenge-programLe" target="_blank" title="researchers.https://nrc.canada.ca/en/research-development/research-collaboration/programs/high-throughput-secure-networks-challenge-programLe">researchers.https://nrc.canada.ca/en/research-development/research-collaboration/programs/high-throughput-secure-networks-challenge-programLe programme Réseaux Sécurisés à Haut Débit (RSHD) organise régulièrement des séries de séminaires virtuels pour promouvoir le partage d’informations scientifiques, les discussions et les interactions entre <a href="http://chercheurs.https://nrc.canada.ca/fr/recherche-developpement/recherche-collaboration/programmes/programme-defi-reseaux-securises-haut-debitCo-sponsored" target="_blank" title="chercheurs.https://nrc.canada.ca/fr/recherche-developpement/recherche-collaboration/programmes/programme-defi-reseaux-securises-haut-debitCo-sponsored">chercheurs.https://nrc.canada.ca/fr/recherche-developpement/recherche-collaboration/programmes/programme-defi-reseaux-securises-haut-debitCo-sponsored by: National Research Council, <a href="http://Canada.Speaker(s):" target="_blank" title="Canada.Speaker(s):">Canada.Speaker(s): Francis Duhamel, Guocheng LiuVirtual: https://events.vtools.ieee.org/m/544407