• BOS Innovations Tour

    2335 Discovery Drive, London, Ontario, Canada, N6M 0C6

    Fanshawe College students have the opportunity to attend a guided tour of one of London’s leading automation and robotics companies. BOS Innovations is recognized for its expertise in industrial automation, robotics integration, and advanced manufacturing solutions across multiple industries. Please note that students are responsible for arranging their own transportation to and from the BOS Innovations facility, located at 2335 Discovery Drive, London, ON N6M 0<a href="http://C6.IF" target="_blank" title="C6.IF">C6.IF YOU REGISTER FOR THIS EVENT AND CAN NO LONGER ATTEND, PLEASE UNREGISTER SO OTHER STUDENTS HAVE THE OPPORTUNITY TO <a href="http://PARTICIPATE.BOS" target="_blank" title="PARTICIPATE.BOS">PARTICIPATE.BOS HAS CONFIRMED THAT THIS TOUR IS EXCLUSIVELY FOR ELY AND EMN STUDENTS. ELIGIBLE STUDENTS WILL BE CONTACTED WITH REGISTRATION DETAILS AND INFORMATION ABOUT THE AVAILABLE JOB <a href="http://OPPORTUNITIES.Co-sponsored" target="_blank" title="OPPORTUNITIES.Co-sponsored">OPPORTUNITIES.Co-sponsored by: BOS Innovations <a href="http://Inc.2335" target="_blank" title="Inc.2335">Inc.2335 Discovery Drive, London, Ontario, Canada, N6M 0C6

  • IEEE Mini-Conference

    Room: A-1300, Bldg: A, 1100 R. Notre Dame O, Montréal, QC H3C 1K3, Montréal, Quebec, Canada, H3C 1K3

    IEEE Mini-ConferenceAre you interested in IEEE technical societies? Don’t miss this opportunity to discover cutting-edge technologies through a mini conference featuring 2 professors and 4 graduate students on diverse subject like terahertz wave, machine learning, RF circuits and others electrical and software engineering <a href="http://topics.Free" target="_blank" title="topics.Free">topics.Free pizza provided for all participants!ETS - A-1300 – March 10 at 12:00 PM (Noon)Co-sponsored by: MTTS - ETSAgenda: 12:00 PM – 12:15 PM : Check-in & Pizza12:15 PM – 12:20 PM : Opening Remarks12:20 PM – 12:45 PM : Faculty "Keynote" Session (20 min + Q&A)-12:20 – 12:30: Richard Al Hadi– RF circuits-(10 min talk + 5 min Q&A)-12:35 – 12:45: WaĂ«l Jaafar - AI-(10 min talk + 5 min Q&A)12:45 PM – 1:10 PM : Graduate Student Lightning Talks (20 min + Q&A)-4 grad students will talk about their research focus in 5 mins format1:10 PM – 1:15 PM : Closing Words1:15 PM – 1:30 PM : Free timeRoom: A-1300, Bldg: A, 1100 R. Notre Dame O, MontrĂ©al, QC H3C 1K3, MontrĂ©al, Quebec, Canada, H3C 1K3

  • A Scalp-EEG Tool for Epilepsy Diagnosis: Getting Patients the Right Answers, Faster

    Virtual: https://events.vtools.ieee.org/m/537663

    Every year, over one million people in the U.S. rush to the emergency room after experiencing their first seizure or seizure-like event. For many, the journey that follows is frustrating and uncertain. Epilepsy is notoriously difficult to diagnose - so much so that nearly 30% of patients receive the wrong diagnosis. The most common mistake? Being told they have epilepsy when they do not. These misdiagnosed patients spend months or even years trying ineffective medications, enduring unnecessary side effects, and living with the fear of seizures they don’t actually have only to later discover they have a completely different condition. Why is diagnosing epilepsy so difficult? Unlike other diseases, there has been no reliable biomarker. Our team has identified an EEG-based biomarker for epilepsy, a game-changing discovery that is currently being tested in three major epilepsy centers across the U.S. This new tool, EpiScalp, has the potential to revolutionize epilepsy diagnosis, ensuring patients receive the right answers and the right treatment from their very first visit to a <a href="http://neurologist.Speaker(s):" target="_blank" title="neurologist.Speaker(s):">neurologist.Speaker(s): Sridevi Sarma, PhD - EMBS Distinguished LecturerVirtual: https://events.vtools.ieee.org/m/537663

  • BEING AN F1 SOFTWARE ENGINEER

    Room: 3033, Bldg: Physics (C), St. John's Campus, Memorial University of Newfoundland (MUN), St. John's, Newfoundland and Labrador, Canada

    About the TalkWhat does it take to build software that powers a Formula 1 team? In this talk, Pelin Hakverir, a Software Engineer at Mercedes AMG Petronas Formula One Team, offers a rare, firsthand look into what it means to work at the intersection of elite motorsport and software <a href="http://engineering.Formula" target="_blank" title="engineering.Formula">engineering.Formula 1 teams operate very differently from conventional tech companies. The organizational structures, the pace, the stakes, and the culture are unlike anything you would encounter in a standard software role. This talk explores what that difference looks like in practice and what it means for the engineers who work <a href="http://there.Whether" target="_blank" title="there.Whether">there.Whether you are a student exploring career paths or an early-career engineer curious about unconventional opportunities, this session will give you a grounded, honest perspective on life inside one of the most high-performance environments in the <a href="http://world.About" target="_blank" title="world.About">world.About the SpeakerPelin Hakverir is a Software Engineer at Mercedes AMG Petronas Formula One Team, a role she has held since January 2023. She holds a degree in Computer Engineering from Istanbul Technical <a href="http://University.Working" target="_blank" title="University.Working">University.Working at one of the most recognized and successful teams in Formula 1, Pelin brings a unique perspective to software engineering, one shaped by the demands of a sport where precision, speed, and reliability are non-negotiable. Her experience bridges the worlds of high-performance motorsport and professional software development, offering insights that are rarely accessible outside the <a href="http://industry.Event" target="_blank" title="industry.Event">industry.Event Details📅 Date: Tuesday, March 11, 2026🕞 Time: 3:30 PM – 4:30 PM📍 Location: Physics (C), Room 3033 St. John's Campus, Memorial University of Newfoundland (MUN)This is a free, in-person event open to all students and early-career engineers. RSVP is required to attend. Please confirm your attendance in advance to secure your <a href="http://spot.Room:" target="_blank" title="spot.Room:">spot.Room: 3033, Bldg: Physics (C), St. John's Campus, Memorial University of Newfoundland (MUN), St. John's, Newfoundland and Labrador, Canada

  • Seattle EMC and AP/ED/MTT Joint Chapter Half-Day Workshop on EMC and Aerospace Measurement Challenges

    Bldg: 2-122, Boeing, 7701 14th Ave Soutn, Seattle, Washington, United States, 98108

    []TECHNICAL PROGRAMThis program is dedicated to the memory of Omar Zubi, Boeing's longtime EMC Lab Manager, who passed away suddenly on January 31, 2026.EMC Challenges for ‘New Space’ Small Satellite DevelopmentBy Russell Carroll, EMI/EMC Consulting Engineer, EMI Sleuth, El Segundo, CA, USAAbstract: This presentation discusses EMC challenges seen by engineers in the ‘new space’ world of small satellite development. These challenges include non-standardized launch vehicle and host interface requirements, unspecified lightning protection requirements, and schedule constraints on EMC testing and development. Technical challenges include power and signal isolation, crosstalk from long pigtails in wire harnesses, limited physical space for filters and shielding, and large apertures in the vehicle faraday <a href="http://cage.Speaker" target="_blank" title="cage.Speaker">cage.Speaker Biography: Russell Carroll is a consulting engineer with extensive experience in the analysis, design, and testing of electromagnetic effects on units and systems including space satellites and industrial electronics. His research is focused on developing useful analysis tools and methods for unit and system level EMC analysis. Mr. Carroll is a registered Professional Engineer and an iNARTE certified EMC Engineer. He received the B.S. and M.S. degrees in electrical engineering from the University of Alaska Fairbanks in 2013 and 2014. He may be reached at russell@<a href="http://emisleuth.com.CISPR" target="_blank" title="emisleuth.com.CISPR">emisleuth.com.CISPR and ANSC C63Âź Overview on Site Validation Measurements from 18 GHz to 40 GHz - Latest Advances in EMC Test Site Evaluation Using Advanced Antenna Measurement TechniquesBy Zhong Chen, Chief Engineer, ETS-Lindgren, Cedar Park, Texas, USAAbstract: This presentation introduces a novel approach for EMC chamber validation beyond 18 GHz, currently under consideration in ANSI C63 and CISPR standards. By integrating Cylindrical Mode Filtered Site Voltage Standing Wave Ratio (CMF SVSWR) with Compressed Sensing (CS), we address inherent challenges in traditional SVSWR methods, such as inconsistency and slow data acquisition. CMF SVSWR utilizes circular path measurements and mode domain post-processing to discern antenna and chamber reflections, crucial for comprehensive VSWR analysis. Compressed Sensing, a data-driven machine learning technique, exploits signal sparsity to reconstruct data from fewer randomly sampled measurement points, thereby reducing test times and eliminating the need for precise turntable <a href="http://positioning.Speaker" target="_blank" title="positioning.Speaker">positioning.Speaker Biography: Zhong Chen is Chief Engineer at ETS-Lindgren, located in Cedar Park, Texas. He has more than 25 years of experience in RF testing, anechoic chamber design, as well as EMC antenna and field probe design and measurements. He is an active member of the ANSC C63Âź committee currently serving as Vice-Chair and is the immediate past Chair of Subcommittee 1 which is responsible for the antenna calibration (ANSI C63.5) and chamber/test site validation standards (ANSI C63.4 and the ANSI C63.25 series). Mr. Chen is chair of the IEEE Standard 1309 committee responsible for developing calibration standards for field probes, and IEEE Standard 1128 for absorber evaluation. He is a former member of the IEEE EMC Society Board of Governors and the Antenna Measurement Techniques Association (AMTA) Board of Directors. He is a past Distinguished Lecturer for the EMC Society and is recognized as an AMTA Fellow. His research interests include measurement uncertainty, time domain measurements for site validation and antenna calibration, and development of novel RF absorber materials. Several papers authored and co-authored by Mr. Chen have received best paper recognition at global conferences. Zhong Chen received his M.S.E.E. degree in Electromagnetics from the Ohio State University at Columbus. He may be reached at <a href="http://[email protected]" target="_blank" title="[email protected]">[email protected] Lab Tour and Demo Overview​By Dennis Lewis, Technical Fellow, The Boeing Company, and Zhong Chen, ETS-LindgrenAbstract:We will demonstrate how data post-processing can be used to extract antenna and chamber <a href="http://parameters.The" target="_blank" title="parameters.The">parameters.The first demo highlights time-domain techniques for evaluating absorber performance in anechoic chambers. In aerospace EMC testing, measurements are typically performed per MIL-STD 461, which requires only 10 dB attenuation above 250 MHz—allowing chambers to remain relatively reflective and without system-level validation. Using time-gated antenna reflection measurements, we show a practical method to verify and quantify actual chamber <a href="http://performance.If" target="_blank" title="performance.If">performance.If time permits, we will also demonstrate the Cylindrical Mode Filtered (CMF) technique. This method measures the antenna pattern with an intentional offset (e.g., placing the antenna at the edge of the turntable). The complex S21 versus angle at each frequency is transformed into the spectral domain, where filtering removes chamber contributions mathematically, producing a “clean” antenna pattern even in a nonideal environment. For site validation, standing-wave ripples are obtained by comparing the original chamber pattern to the filtered result. The demo will cover the full measurement workflow, including real-time post-processing. The CMF SVSWR technique is under consideration in the draft ANSI C63.25.3 by ANSC C63 and in CISPR 16 site validation standards for EMC test sites from 18 GHz to 40 <a href="http://GHz.MANY" target="_blank" title="GHz.MANY">GHz.MANY THANKS TO OUR LUNCH SPONSOR ROHDE & SCHWARZ!!Agenda: 1:00 pm - Registration Check-In and Complimentary Lunch Courtesy of Rohde & Schwarz1:40 pm - Welcome from Seattle EMC Chapter Chair, Janet O'Neil with ETS-Lindgren and Seattle AP/ED/MTT Chapter Chair, Dennis Lewis with Boeing1:45 pm - EMC Challenges for ‘New Space’ Small Satellite Development By Russell Carroll, EMI/EMC Consulting Engineer, EMI Sleuth, El Segundo, CA, USA2:30 pm - CISPR and ANSC C63Âź Overview on Site Validation Measurements from 18 GHz to 40 GHz - Latest Advances in EMC Test Site Evaluation Using Advanced Antenna Measurement Techniques By Zhong Chen, Chief Engineer, ETS-Lindgren, Cedar Park, Texas, USA3:30 pm - Refreshment Break3:50 pm - Overview of Boeing EMC Lab and Demo Set Up by Dennis Lewis, Technical Fellow with Boeing and Zhong Chen with ETS-Lindgren4:20 pm - Technical tour of the Boeing EMC Lab with LIVE demo5:00 pm - AdjournBldg: 2-122, Boeing, 7701 14th Ave Soutn, Seattle, Washington, United States, 98108

  • Quantum dot spins and single-photon emitters for scalable quantum technologies

    Virtual: https://events.vtools.ieee.org/m/545420

    Quantum technologies harness the unique properties of quantum mechanics to realize new functionalities and superior performance in computing, communication, and sensing, which are simply impossible using classical mechanics. As such, quantum technologies impact a wide range of applications, including biomedical imaging, drug development, artificial intelligence, energy grid optimization, energy materials development, cybersecurity and cryptography, financial modelling, logistics optimization, and weather forecasting, to name just a few. Such a wide range of applications was highlighted in recent reports which projected that the global quantum computing sector alone will be worth nearly $1.3 trillion by 2035 (McKinsey) and that Canada’s quantum technology sector will have a value of $139 billion by 2045 (NRC).In this seminar, I will present an overview of my research into the development of scalable photonic quantum technologies. Firstly, I will present my work that led to the demonstration of spin qubit initialization in single InAs/GaAs self-assembled quantum dots with high fidelity, on picosecond timescales, and without the need for applied magnetic fields. Then, I will present my work on the localization of single-photon emitters in 2D hexagonal boron nitride towards the development of atomically-thin quantum light-emitting diodes (QLEDs) operating at room temperature. Next, I will describe my research on machine learning-assisted optical measurements of quantum-dot single-photon emitters with high precision and high throughput towards the development of scalable photonic quantum technologies. Finally, I will discuss my research on nitrogen vacancy (NV) colour centers in nanodiamond and their optical coupling to plasmonic nanocavities for the realization of bright single-photon emitters and thus the development of a wide range of photonic quantum <a href="http://technologies.Speaker(s):" target="_blank" title="technologies.Speaker(s):">technologies.Speaker(s): Jonathan, Virtual: https://events.vtools.ieee.org/m/545420

  • Rencontre des membres IEEE Power & Energy Society (PES) – RĂ©gion de QuĂ©bec

    Virtual: https://events.vtools.ieee.org/m/540109

    La Section IEEE de QuĂ©bec invite tous les membres PES de la rĂ©gion Ă  une rencontre visant Ă  Ă©valuer la crĂ©ation d’un Chapitre IEEE PES Ă  QuĂ©<a href="http://bec.Avec" target="_blank" title="bec.Avec">bec.Avec prĂšs de 50 membres PES dans la Section — la SociĂ©tĂ© la plus reprĂ©sentĂ©e localement — nous souhaitons structurer cette communautĂ© autour d’un Chapitre <a href="http://officiel.Objectifs" target="_blank" title="officiel.Objectifs">officiel.Objectifs de la rencontre :-Valider l’intĂ©rĂȘt rĂ©el pour la crĂ©ation du Chapitre PES Ă  QuĂ©bec-Identifier au moins 12 membres prĂȘts Ă  appuyer formellement l’ouverture du Chapitre, afin d’enclencher le processus officiel IEEECette rencontre s’adresse Ă  tous les membres IEEE PES de la rĂ©gion qui souhaitent contribuer au dĂ©veloppement de la communautĂ© Ă©nergie Ă  QuĂ©<a href="http://bec.Votre" target="_blank" title="bec.Votre">bec.Votre prĂ©sence fera la diffĂ©<a href="http://rence.Virtual:" target="_blank" title="rence.Virtual:">rence.Virtual: https://events.vtools.ieee.org/m/540109

  • VTS Chapter (Toronto Section): Finalizing 2026 Funding Request & Event Planning

    Virtual: https://events.vtools.ieee.org/m/545410

    Meeting Agenda1. Review of Progress & Objectives (5 mins)-Quick recap of action items from the last <a href="http://meeting.-Goal" target="_blank" title="meeting.-Goal">meeting.-Goal Check: Confirm status of vTools officer updates and bank account information <a href="http://gathering.-Confirm" target="_blank" title="gathering.-Confirm">gathering.-Confirm today's goal: Lock in the 2026 activity plan and finalize the narrative for the funding <a href="http://request.2" target="_blank" title="request.2">request.2. vTools & Compliance Status Update (5 mins)-Confirm that all officer details (including term start/end dates) are now accurate in <a href="http://vTools.-Discuss" target="_blank" title="vTools.-Discuss">vTools.-Discuss any clarifications needed regarding the "treasurer exception" (if applicable).3. Finalizing the 2026 Activity Lineup (20 mins)-This section focuses on the "What" and "Why" for the funding <a href="http://request.-Review" target="_blank" title="request.-Review">request.-Review Brainstormed Ideas: Present the list of proposed activities from the last <a href="http://meeting.-Prioritization" target="_blank" title="meeting.-Prioritization">meeting.-Prioritization & Feasibility:-Which activities are "must-do" for 2026?-Which are "nice-to-have"?-Identify potential speakers, venues, or collaboration opportunities for <a href="http://each.-Confirm" target="_blank" title="each.-Confirm">each.-Confirm Activity Details: For each priority activity, briefly outline:-Proposed Title-Target Month/Quarter-Estimated Audience Size4. Drafting the Funding Request Narrative (15 mins)-This section focuses on the "How Much" and translating activities into the formal <a href="http://request.-Budget" target="_blank" title="request.-Budget">request.-Budget Mapping: Map the finalized activities to the <a href="http://budget.-Narrative" target="_blank" title="budget.-Narrative">budget.-Narrative Review: Review the draft narrative (if prepared beforehand) or collectively write the key bullet <a href="http://points.-Tip:" target="_blank" title="points.-Tip:">points.-Tip: Focus on member value and technical impact, using "activity" terminology as required by <a href="http://IEEE.-Consolidation:" target="_blank" title="IEEE.-Consolidation:">IEEE.-Consolidation: Ensure the budget numbers align perfectly with the proposed <a href="http://activities.5" target="_blank" title="activities.5">activities.5. Final Action Items & Timeline (10 mins)-Assign the final writing/editing of the funding request <a href="http://document.-Confirm" target="_blank" title="document.-Confirm">document.-Confirm who will submit the form by the 16 March <a href="http://deadline.-Set" target="_blank" title="deadline.-Set">deadline.-Set an internal review deadline (e.g., "Draft ready for review by 13 March").-Plan next steps for event logistics (e.g., "Secretary to contact venue X regarding April date").6. Final Q&A & Open Discussion (5 mins)-Last chance for the VTS Chapter Chair to clarify any remaining <a href="http://questions.7" target="_blank" title="questions.7">questions.7. AdjournmentVirtual: https://events.vtools.ieee.org/m/545410

  • Quantum Dot Lasers Integrated via Optical Interconnects Using 3D-Printed Structured Microlenses and Photonic Wire Bonding

    Virtual: https://events.vtools.ieee.org/m/544407

    Quantum Dot Lasers Integrated via Optical Interconnects Using 3D-Printed Structured Microlenses and Photonic Wire BondingAbstract:Hybrid-integrated quantum dot (QD) coherent comb lasers provide broad bandwidth and high coherence, making them attractive for demanding applications such as precision metrology, high-capacity optical communications, and quantum information processing, especially when integrated with photonic integrated circuits (PICs). Various approaches have been explored to integrate III–V gain devices with silicon photonics, including monolithic, heterogeneous, and hybrid integration. However, each method faces challenges in reproducibility, scalability, and coupling efficiency. Recently, 3D-printed structures, including micro-lens and photonic wire bonding (PWB), have emerged as a promising solution. In this approach, a femtosecond pulsed laser is used to directly write low-loss polymer waveguides in three dimensions. These 3D-printed structures significantly reduce alignment sensitivity, offering two to three orders of magnitude higher tolerance compared to techniques such as flip-chip bonding, which requires sub-micron alignment accuracy in all three axes. This high tolerance enables efficient and low-loss coupling between different optical interfaces, including optical fibers, surface-emitting lasers, and edge-emitting lasers. Here, we demonstrate a co-packaging approach for hybrid-integrated QD multi-wavelength coherent comb lasers using PWB and 3D-printed micro-lens structures. Experimental results show stable comb mode locking, narrow optical linewidths, and low relative intensity noise, while maintaining a compact footprint. This work paves the way for robust hybrid photonic platforms for applications in quantum technologies, precision metrology, and advanced optical <a href="http://communications.------------------------------------------------------------------------Lasers" target="_blank" title="communications.------------------------------------------------------------------------Lasers">communications.------------------------------------------------------------------------Lasers Ă  points quantiques intĂ©grĂ©s via des interconnexions optiques utilisant des microlentilles structurĂ©es imprimĂ©es en 3D et la liaison par fil photoniqueRĂ©sumĂ©:Les lasers Ă  peigne de frĂ©quences cohĂ©rents Ă  points quantiques (PQ) hybrides offrent une large bande passante et une grande cohĂ©rence, ce qui les rend particuliĂšrement intĂ©ressants pour des applications exigeantes telles que la mĂ©trologie de prĂ©cision, les communications optiques Ă  haut dĂ©bit et le traitement de l’information quantique, notamment lorsqu’ils sont intĂ©grĂ©s Ă  des circuits photoniques intĂ©grĂ©s (PIC). DiffĂ©rentes approches ont Ă©tĂ© explorĂ©es pour intĂ©grer des dispositifs Ă  gain III-V Ă  la photonique sur silicium, notamment l’intĂ©gration monolithique, hĂ©tĂ©rogĂšne et hybride. Cependant, chaque mĂ©thode prĂ©sente des dĂ©fis en termes de reproductibilitĂ©, d'Ă©volutivitĂ© et d'efficacitĂ© de couplage. RĂ©cemment, les structures imprimĂ©es en 3D, notamment les microlentilles et le cĂąblage photonique (PWB), sont apparues comme une solution prometteuse. Dans cette approche, un laser pulsĂ© femtoseconde est utilisĂ© pour Ă©crire directement des guides d'ondes polymĂšres Ă  faibles pertes en trois dimensions. Ces structures imprimĂ©es en 3D rĂ©duisent considĂ©rablement la sensibilitĂ© Ă  l’alignement, offrant une tolĂ©rance de deux Ă  trois ordres de grandeur supĂ©rieure Ă  celle de techniques telles que le flip-chip, qui exige une prĂ©cision d’alignement submicronique sur les trois axes. Cette tolĂ©rance Ă©levĂ©e permet un couplage efficace et Ă  faibles pertes entre diffĂ©rentes interfaces optiques, notamment les fibres optiques, les lasers Ă  Ă©mission de surface et les lasers Ă  Ă©mission par tranche. Nous prĂ©sentons ici une approche de co-encapsulation pour des lasers Ă  peigne de frĂ©quences cohĂ©rents multi-longueurs d'onde Ă  points quantiques intĂ©grĂ©s hybrides, utilisant des circuits imprimĂ©s et des structures de microlentilles imprimĂ©es en 3D. Les rĂ©sultats expĂ©rimentaux dĂ©montrent un verrouillage de mode stable du peigne, des largeurs de raie optiques Ă©troites et un faible bruit d'intensitĂ© relative, tout en conservant un encombrement rĂ©duit. Ces travaux ouvrent la voie Ă  des plateformes photoniques hybrides robustes pour des applications dans les technologies quantiques, la mĂ©trologie de prĂ©cision et les communications optiques avancĂ©<a href="http://es.In" target="_blank" title="es.In">es.In order to promote more open discussions/interactions, at the end of the presentation and Q/A, we will allow other experts in this field (modeling of semiconductor laser) to present very briefly their work (1 slide, 2 min max) or their company. / Afin de favoriser des discussions/interactions plus ouvertes, Ă  la fin de la prĂ©sentation et des questions/rĂ©ponses, nous permettrons aux experts de ce domaine (modĂ©lisation de lasers semi-conducteurs) de prĂ©senter trĂšs briĂšvement leurs travaux (1 diapositive, 2 min max) ou leur <a href="http://compagnie.About" target="_blank" title="compagnie.About">compagnie.About / A proposThe High Throughput and Secure Networks (HTSN) Challenge program is hosting regular virtual seminar series to promote scientific information sharing, discussions, and interactions between <a href="http://researchers.https://nrc.canada.ca/en/research-development/research-collaboration/programs/high-throughput-secure-networks-challenge-programLe" target="_blank" title="researchers.https://nrc.canada.ca/en/research-development/research-collaboration/programs/high-throughput-secure-networks-challenge-programLe">researchers.https://nrc.canada.ca/en/research-development/research-collaboration/programs/high-throughput-secure-networks-challenge-programLe programme RĂ©seaux SĂ©curisĂ©s Ă  Haut DĂ©bit (RSHD) organise rĂ©guliĂšrement des sĂ©ries de sĂ©minaires virtuels pour promouvoir le partage d’informations scientifiques, les discussions et les interactions entre <a href="http://chercheurs.https://nrc.canada.ca/fr/recherche-developpement/recherche-collaboration/programmes/programme-defi-reseaux-securises-haut-debitCo-sponsored" target="_blank" title="chercheurs.https://nrc.canada.ca/fr/recherche-developpement/recherche-collaboration/programmes/programme-defi-reseaux-securises-haut-debitCo-sponsored">chercheurs.https://nrc.canada.ca/fr/recherche-developpement/recherche-collaboration/programmes/programme-defi-reseaux-securises-haut-debitCo-sponsored by: National Research Council, <a href="http://Canada.Speaker(s):" target="_blank" title="Canada.Speaker(s):">Canada.Speaker(s): Francis Duhamel, Guocheng LiuVirtual: https://events.vtools.ieee.org/m/544407

  • LeadHERship: Women’s Day

    Room: ICT 516, Bldg: ICT, 2500 University Drive NW, Calgary, Alberta, Canada, T2N 1N4

    []Well known University of Calgary Professor and Associate Head, Dr. Elise Fearwill meet us in a session to share her story, professional and personal journey, including the challenges she has faced and the experiences that have inspired <a href="http://her.IEEE" target="_blank" title="her.IEEE">her.IEEE Women in Engineering invite you to participate and join us for a relaxed mixer with networking opportunity. Light food and drinks will be <a href="http://served.All" target="_blank" title="served.All">served.All members of the community are welcome to attend. Please RSVP so we can attendance count for food and <a href="http://logistics.Speaker(s):" target="_blank" title="logistics.Speaker(s):">logistics.Speaker(s): Dr. Elise Fear, Agenda: 4:00 pm Event Begins4:05 pm Introduction4:10 pm Dr. Elise Fear Presentation5:00 pm Q&A/Food and Networking5:55 Pm Event ClosesRoom: ICT 516, Bldg: ICT, 2500 University Drive NW, Calgary, Alberta, Canada, T2N 1N4