The (https://vancouver.ieee.ca) and the IEEE Future Directions Committee are organizing a series of presentations to address the widespread interest in clean energy sources, new nuclear reactor technologies, and the various related issues. This series of talks will cover aspects of nuclear energy and the disruptive new technology of Small Modular Reactors. These presentations will be of interest both to engineers who are not nuclear specialists, and to the general public who are interested in learning about the <a href="http://technology.TOPIC:Integration" target="_blank" title="technology.TOPIC:Integration">technology.TOPIC:Integration of SMRs in Renewable Energy MicrogridsDATE: July 30, 2025LOCATION: OnlinePRESENTER: Dr. Dennis MichaelsonDr. Dennis Michaelson will explore the application of Small Modular Reacrors (SMRs) in remote community power systems and off-grid industrial facilities. In some of these applications, a small SMR or micro-modular reactor would be combined with renewable power sources, energy storage, and loads to form a microgrid. In this talk we will explore potential configurations and operating scenarios for such systems, and discuss the considerations and trade-offs involved in their <a href="http://design.This" target="_blank" title="design.This">design.This presentation is free. IEEE members and the general public are welcome to attend. Registration is <a href="http://required.This" target="_blank" title="required.This">required.This presentation series is organized by:- (<a href="https://ieee-sustech.org/2023/ieees-sustech-initiative/)-" target="_blank" title="https://ieee-sustech.org/2023/ieees-sustech-initiative/)-">https://ieee-sustech.org/2023/ieees-sustech-initiative/)- (<a href="https://vancouver.ieee.ca/physics)This" target="_blank" title="https://vancouver.ieee.ca/physics)This">https://vancouver.ieee.ca/physics)This presentation series is supported by:- (<a href="https://ieee-npss.org/)-" target="_blank" title="https://ieee-npss.org/)-">https://ieee-npss.org/)- (<a href="https://ieee-npss.org/)Co-sponsored" target="_blank" title="https://ieee-npss.org/)Co-sponsored">https://ieee-npss.org/)Co-sponsored by: IEEE Future Directions Committee, IEEE SusTech InitiativeSpeaker(s): Dr. Dennis MichaelsonAgenda: The presentation will start at 9:00 AM Pacific Time (12:00 EDT, 16:00 UTC).09:00 Welcome and Speaker Introduction09:10 Presentation09:50 Questions and Answers10:00 Presentation endsNOTE If you have registered, you should receive the Zoom URL in a separate email, shortly before the presentation time. Please check your email spam <a href="http://folder.NOTE" target="_blank" title="folder.NOTE">folder.NOTE Please be sure to leave sufficient time to set up your web browser and / or remote meeting client prior to the start <a href="http://time.Virtual:" target="_blank" title="time.Virtual:">time.Virtual: https://events.vtools.ieee.org/m/488978

IEEE CAS Toronto is proud to invite you to a seminar by Dr. Chen Jie of Fudan <a href="http://University.Join" target="_blank" title="University.Join">University.Join us Wednesday, 30 July 2025 at 10AM (ET) on University of Toronto main campus. Refreshments will be <a href="http://served.Abstract:---------------------------------------------------------------With">served.Abstract:---------------------------------------------------------------[]With the advancement of microfluidic and organoid technologies, neuron-on-a-chip platforms have demonstrated tremendous potential in precisely replicating the three-dimensional structure of the brain, simulating intercellular interactions, and reconstructing in vitro physiological models. On one hand, compared to traditional two-dimensional cell cultures, neuron-on-a-chip systems can not only construct more complex physiological architectures but also provide a dynamically controllable developmental environment for neural tissues. On the other hand, compared to animal models, brain-on-a-chip technology not only effectively addresses the limitations in the number of available animal models, but also alleviates, to some extent, the ethical concerns associated with animal experiments. Through induced pluripotent stem cell (iPSC) technology, we can directly model human brain pathological phenotypes on chips, overcoming challenges posed by interspecies differences in animal models, and enabling the investigation of key events in the progression of human neurological disorders. In addition, neuron-on-a-chip systems can be integrated with other organoid tissues on microfluidic chips to create multi-organ-on-a-chip platforms. Compared to single-organ chips, multi-organ systems can reconstruct multiple human tissue organoids in vitro, enabling precise simulation of inter-organ <a href="http://interactions.Speaker(s):" target="_blank" title="interactions.Speaker(s):">interactions.Speaker(s): Dr. Chen Jie, Room: BA024, Bldg: Bahen Centre for Information Technology, Toronto, Ontario, Canada

The traditional AC grid is undergoing a transition from a few large centralized synchronous generators to hundreds or thousands of local, renewable, inverter-based generation (IBRs), primarily wind and solar. The two modes of generation are based on different technologies, and their integration into a single hybrid system presents a number of technical challenges, while also opening up opportunities for the development of geographical equality, environmental preservation, and increased resilience. A significant amount of expertise and high levels of reliability have been developed over the past 139 years of the AC power industry. With the emergence of renewables, many of standard ideas for designing and operating electric power grids will need to change. In this talk, we will discuss the need for new tools of analysis, extensive data collection, and the role of AI in maintaining optimum operation of AC systems with significant DC penetration. We will also mention some of the tools available for improving the system's resilience while preserving the environment and the well-being of the population during system failure and natural <a href="http://disasters.Speaker(s):" target="_blank" title="disasters.Speaker(s):">disasters.Speaker(s): Dr. José MartiRoom: 3038, Bldg: Macleod building, 2356 Main Mall, Vancouver, British Columbia, Canada, V6T 1Z4, Virtual: https://events.vtools.ieee.org/m/493060

Participants are required to provide their own Safety Work Shoes and Safety Glasses for this Plant Tour. Hearing protection will be <a href="http://provided.Autoneum" target="_blank" title="provided.Autoneum">provided.Autoneum develops and produces multifunctional, lightweight components for optimum noise and heat protection for the automotive industry. The innovative products and technologies make vehicles quieter, safer and lighter and therefore help to reduce fuel consumption and emissions. The London Plant features the use of: robots, PLC’s, hydraulic presses, pneumatic systems, RF welders, cutting with high pressure water, chillers, compressors, <a href="http://etc.Speaker(s):" target="_blank" title="etc.Speaker(s):">etc.Speaker(s): , MinhAgenda: 9:00 – 9:15 Introduction, safety review9:20-10:20 Plant tour10:25-11:15 Wrap up, questions, suggestions, refreshments1800 Huron Street, London, Ontario, Canada, N5V 3A6

This talk will explore the fundamentals of signal integrity (SI) in high-speed applications, with a focus on both frequency- and time-domain analysis. Attendees will gain a foundational understanding of how signal loss, crosstalk, and reflections affect system performance at high data rates. The presentation will also highlight recent advances in packaging techniques for broadband applications, including chiplets and advanced interconnects, and how these innovations help address challenges in high-frequency design. This session aims to bridge the gap between SI fundamentals and modern packaging technologies, offering a comprehensive overview for engineers and students working on broadband <a href="http://systems.At" target="_blank" title="systems.At">systems.At the end of the talk, the speaker will provide a summary of IEEE resources available to students and young professionals in the RF <a href="http://field.Speaker(s):" target="_blank" title="field.Speaker(s):">field.Speaker(s): Dr. Ahmed Abdelltif, 200 University Ave W, Waterloo, Ontario, Canada, N2L 3G1

[]Join the IEEE Toronto Instrumentation & Measurement – Robotics & Automation Joint Chapter for a technical talk presented by Dr. Roya Fallah Firoozi from University of <a href="http://Waterloo.Monday" target="_blank" title="Waterloo.Monday">Waterloo.Monday, August 11, 2025 @ 1:00 – 2:00 PM (EST)Abstract: As a robot manipulates 3D objects and navigates within 3D scenes, it requires spatial reasoning to ensure safe planning. Recent advances in 3D scene representation, such as Neural Radiance Fields (NeRFs) and Gaussian Splatting, provide high-fidelity digital twins of arbitrary real-world environments from multi-view images. In the first part of the talk, Dr. Firoozi will discuss employing these 3D visual fields augmented to 3D vision-language fields using internet-scale semantic representations from Vision-Language Models (VLMs) for open-vocabulary robot <a href="http://planning.As" target="_blank" title="planning.As">planning.As the robot interacts with other dynamic agents in the scene (multi-agent settings), it also requires temporal reasoning to ensure safe interactive planning. In the second part of the talk, Dr. Firoozi will discuss safe and fault-resilient planning techniques across two categories of interactive planning: (i) Model Predictive Control (MPC), where the prediction and planning steps are decoupled, and (ii) more abstract approaches such as game-theoretic planning, where these steps are tightly coupled. While MPC offers computational efficiency, game-theoretic planning enables more complex modeling of agents' preferences and their mutual <a href="http://influences.Speaker(s):" target="_blank" title="influences.Speaker(s):">influences.Speaker(s): Roya Fallah Firoozi, Ph.D., Virtual: https://events.vtools.ieee.org/m/487494

Emerging Developments in GHz Engineering (EDGE) 2025Emerging Developments in GHz Engineering (EDGE) 2025 marks the official inauguration of the IEEE MTT-S Thompson Okanagan Chapter. This full-day event is dedicated to advancing knowledge and collaboration in microwave, RF, and GHz-frequency engineering. EDGE 2025 brings together academic leaders, industry experts, researchers, and students for an engaging program featuring keynote talks, panel discussions, technical sessions, lab tours, and project demonstrations. The summit aims to establish a strong regional hub for innovation and excellence in GHz technologies, providing valuable networking and learning <a href="http://opportunities.The" target="_blank" title="opportunities.The">opportunities.The day begins with remarks from the executive members of the IEEE Thompson Okanagan Section, and interim officers of the MTT-S chapter, followed by the formal inauguration ceremony. Attendees will enjoy a range of activities including an industry panel, a Distinguished Microwave Lecture, a Young Professionals talk, and a networking lunch. Lab visits, project demonstrations, and a poster session offer hands-on experiences, while invited talks and industry presentations explore advanced microwave topics. The event concludes with student and technical presentations showcasing innovative research by emerging engineers and <a href="http://scientists.Agenda:" target="_blank" title="scientists.Agenda:">scientists.Agenda: Morning SessionTime Activity08:00 – 09:00 Breakfast and Networking09:00 – 09:50 Welcome Note and Inaugration of IEEE MTT-S Chapter09:50 – 10:10 Break10:10 – 11:00 Industry Panel Discussion11:00 – 11:30 Distinguished Microwave Lecture (DML) Talk11:30 – 12:00 Young Professionals (YP) Talk12:00 – 13:00 Lunch Break---------------------------------------------------------------Afternoon SessionTime Activity13:00 – 14:00 Lab Visits / Project Demonstrations14:00 – 14:30 Invited Talk14:30 – 15:00 Industry Talk15:00 – 16:00 Student / Technical PresentationsRoom: EME 0050, Bldg: UBC Okanagan Engineering, Management and Education Building, 1137 Alumni Avenue, Kelowna, British Columbia, Canada

Event will be limited to 25 <a href="http://participants.Join" target="_blank" title="participants.Join">participants.Join the IEEE London Chapter for an exclusive behind-the-scenes tour of the Fraunhofer Innovation Platform for Composites Research at Western University (FIP-Composites@Western) in London, Ontario. This is a fantastic opportunity to explore the innovation behind composite materials formulation, process and product development at this industrial-scale applied research facility that is part of Western <a href="http://University.About" target="_blank" title="University.About">University.About the Facility:The Fraunhofer Innovation Platform for Composites Research is a joint venture between Western University and the Fraunhofer Institute of Chemical Technology (ICT) in Pfinztal, Germany. The FIP-Composites at Western develop, test, validate, and characterize new lightweight materials and advanced manufacturing processes on an industrial scale. By combining Fraunhofer’s latest global technologies with Western’s strengths in materials engineering, the FIP-Composites at Western proactively addresses the needs of its industry <a href="http://partners.https://www.eng.uwo.ca/fraunhofer/Agenda:" target="_blank" title="partners.https://www.eng.uwo.ca/fraunhofer/Agenda:">partners.https://www.eng.uwo.ca/fraunhofer/Agenda: What to Expect:- Experience a close-up view of the industrial-scale applied research centre, part of Western <a href="http://University.-" target="_blank" title="University.-">University.- Discover Western’s state-of-the-art composites processing <a href="http://equipment.-" target="_blank" title="equipment.-">equipment.- Capabilities:- 2500 Tonne Compression Molding Press- 1600 Tonne and 500 Tonne Injection Molding Presses- Sheet Molding Compound Line- Long Fiber Thermoplastic Directline- High-Pressure Resin Transfer Molding Line- Pultrusion Line2520 Advanced Avenue, London, Ontario, Canada, N6M 0E1

[]Hi IEEE Members and Student Members in Vancouver,As you may know, the World Science Fiction Convention is coming to Seattle from 13-17 August 2025!<a href="https://seattlein2025.orgIEEE" target="_blank" title="https://seattlein2025.orgIEEE">https://seattlein2025.orgIEEE will be there, and you have an opportunity to attend and contribute as an IEEE member or student member alongside your peers from Seattle <a href="http://Section.In" target="_blank" title="Section.In">Section.In coming days, we'll post more detailed information concerning:- instructions for registering for the conference (you have multiple options including day passes, full conference registration, <a href="http://etc.)https://seattlein2025.org/memberships/memberships/-" target="_blank" title="etc.)https://seattlein2025.org/memberships/memberships/-">etc.)https://seattlein2025.org/memberships/memberships/- how to volunteer to help staff the IEEE booth @ Worldcon- helpful advice regarding overnight accommodation in the Seattle areaIEEE members like myself, Alon Newton, John Vertner, and Tom Coughlin (2024 President) will be at Worldcon. We hope that you can join us!In the meantime, please help us plan ahead by registering through this vTools page so that we can gauge interest and keep you informed. At this point, you’re simply expressing interest. Final confirmation won’t be required for a few <a href="http://weeks.David" target="_blank" title="weeks.David">weeks.David MichelsonCounsellor, IEEE Student Branch @ UBCBldg: Summit Expansion, Seattle Convention Center, 900 Pine Street, Seattle, Washington, United States, 98101

Welcome to WindEEE! Please meet us in the lobby at the WindEEE Research Institute, located at 2535 Advanced Avenue, London, Ontario. Parking is located to the right of the building, follow the sidewalk to the main entrance on the left. You will need to ring the doorbell to be let <a href="http://in.How" target="_blank" title="in.How">in.How to Prepare for your Tour:You will be sitting, standing, walking, and briefly experiencing simulated tornado winds. An optional climb up and down a stepped ladder may be included depending on time/accessibility. Tours typically last between 60-90 <a href="http://minutes.Please" target="_blank" title="minutes.Please">minutes.Please wear comfortable, closed-toed shoes and clothing that won't get blown around (pants and fitted shirts are best). Avoid loose accessories or anything lightweight that might take flight. That said, get ready to let your hair down for some great photo opportunities!We look forward to seeing you!Agenda: You will be sitting, standing, walking, and briefly experiencing simulated tornado winds. An optional climb up and down a stepped ladder may be included depending on time/accessibility. Tours typically last between 60-90 <a href="http://minutes.2535" target="_blank" title="minutes.2535">minutes.2535 Advanced Avenue, London, Ontario, Canada, N6M 0E2

Abstract :This talk will cover the current status of co-packaging efforts, both VCSEL- and SiPh-based, where they fit into the Ethernet switch market and the evolving Computer IO market, and how these technologies are advancing HPC, Data Center, and AI applications. The emphasis will be on new requirements and challenges driven by AI <a href="http://systems.Co-sponsored" target="_blank" title="systems.Co-sponsored">systems.Co-sponsored by: <a href="http://C2MI.Speaker(s):" target="_blank" title="C2MI.Speaker(s):">C2MI.Speaker(s): Daniel M. KuchtaAgenda: 9h45-10h30: arrival of participants on-site, coffee and networking10:30am-11:30am: Tech Talk (hybrid)11:30am-12pm: C2MI lab tour on-site for IEEE Photonics Montreal members12pm: departure and end of eventBldg: C2MI, C2MI, 45 Blvd de l'Aeroport, Bromont, Quebec, Canada, J2L 1S8, Virtual: https://events.vtools.ieee.org/m/491772

Monthly Executive Team Meeting - IEEE Hamilton Section (Aug'2025)Agenda: 07:00PM - Meeting starts08:00PM - Meeting endsVirtual: https://events.vtools.ieee.org/m/494398